The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Sep. 04, 2020
Applicant:

Hitachi High-tech Corporation, Tokyo, JP;

Inventors:

Takehiro Hirai, Tokyo, JP;

Yohei Minekawa, Tokyo, JP;

Satoshi Takada, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); G01N 23/223 (2006.01);
U.S. Cl.
CPC ...
G06T 7/0004 (2013.01); G01N 23/223 (2013.01); G01N 2223/6116 (2013.01); G01N 2223/646 (2013.01); G06T 2207/10061 (2013.01); G06T 2207/10116 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/30148 (2013.01);
Abstract

The present disclosure proposes a system for detecting a foreign material adhering to or a scratch formed on a bevel at an edge of a semiconductor wafer in order to detect the foreign material or defect on the bevel without using a reference image and including a learning device () that outputs information on the foreign material adhering to or the scratch formed on the bevel as a learning result, in which the learning device performs learning in advance by using image data acquired by an image acquisition tool and the information on the foreign material or the scratch on the bevel included in the image data, and the foreign material or the scratch is detected by inputting the image data obtained by the image acquisition tool to the learning device (refer to FIG.).


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