The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Oct. 11, 2023
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Kai Takahashi, Tochigi, JP;

Kenichiro Mori, Tochigi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/50 (2026.01); B29C 65/78 (2006.01); H10P 72/00 (2026.01); H10P 72/70 (2026.01);
U.S. Cl.
CPC ...
B29C 65/7802 (2013.01); B29C 65/7841 (2013.01); H10P 72/0606 (2026.01); H10P 72/50 (2026.01); H10P 72/53 (2026.01); H10P 72/7434 (2026.01);
Abstract

A bonding apparatus for bonding a second object to a first object, including a holding unit configured to hold a sheet with the second object stuck thereto, a protrusion mechanism configured to protrude the second object to a side of the first object via the sheet held by the holding unit, a measurement unit configured to measure, with respect to the first object, a position of the second object stuck to the sheet held by the holding unit, and a processing unit configured to perform a process of positioning the first object and the second object based on the position measured by the measurement unit in a state in which the second object is protruded to the side of the first object by the protrusion mechanism.


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