The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

May. 31, 2021
Applicant:

Koh Young Technology Inc., Seoul, KR;

Inventors:

Guk Han, Ansan-si, KR;

Jae Hwan Lee, Seoul, KR;

Duk Young Lee, Suwon-si, KR;

Chan Woo Park, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/00 (2006.01); G05B 13/04 (2006.01);
U.S. Cl.
CPC ...
B23K 3/00 (2013.01); G05B 13/042 (2013.01);
Abstract

An electronic apparatus according to various embodiments of the present disclosure may include: a communication circuit that is communicatively connected to a solder printing apparatus and a measurement apparatus; one or more memories; and one or more processors. One or more processors may be configured to: acquire a first control parameter set of the solder printing apparatus for printing solder on a first substrate; transmit information indicating the first control parameter set to the solder printing apparatus; acquire first solder measurement information indicating a state of the solder printed on the first substrate; determine a first yield for the first substrate based on the first solder measurement information; and generate a model for searching for an optimal control parameter set based on a first data pair including the first control parameter set and the first yield.


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