The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2026
Filed:
Jul. 31, 2023
Applicant:
Sandisk Technologies, Inc., Milpitas, CA (US);
Inventors:
Assignee:
Sandisk Technologies, Inc., Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 74/10 (2026.01); H10B 80/00 (2023.01); H10W 42/20 (2026.01); H10W 74/01 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 74/121 (2026.01); H10B 80/00 (2023.02); H10W 42/20 (2026.01); H10W 74/01 (2026.01); H10W 90/00 (2026.01); H10W 74/10 (2026.01); H10W 90/752 (2026.01); H10W 90/754 (2026.01);
Abstract
A semiconductor package includes an insulation layer provided between a molding compound and an electromagnetic interface (EMI) layer. The insulation layer covers an exposed portion of a bond wire that extends beyond a top surface of the molding compound due to a Z-height reduction of the molding compound. The insulation layer prevents a short from occurring between the bond wire and the EMI layer.