The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2026
Filed:
Sep. 02, 2022
Applicant:
Globalfoundries U.s. Inc., Malta, NY (US);
Inventors:
John C. Malinowski, Jericho, VT (US);
Zhuojie Wu, Port Chester, NY (US);
Assignee:
GLOBALFOUNDRIES U.S. Inc, Malta, NY (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H10D 1/60 (2025.01); H10W 40/00 (2026.01); H10W 40/22 (2026.01); H10W 72/00 (2026.01); H10W 72/20 (2026.01); H10W 72/30 (2026.01); H10W 74/15 (2026.01); H10W 90/00 (2026.01); H10W 99/00 (2026.01);
U.S. Cl.
CPC ...
H10W 40/00 (2026.01); H10W 40/22 (2026.01); H10W 72/072 (2026.01); H10W 72/07235 (2026.01); H10W 72/07236 (2026.01); H10W 72/073 (2026.01); H10W 72/07332 (2026.01); H10W 72/07353 (2026.01); H10W 72/07354 (2026.01); H10W 72/241 (2026.01); H10W 72/248 (2026.01); H10W 72/252 (2026.01); H10W 72/325 (2026.01); H10W 72/332 (2026.01); H10W 72/337 (2026.01); H10W 72/347 (2026.01); H10W 72/352 (2026.01); H10W 72/353 (2026.01); H10W 72/354 (2026.01); H10W 72/357 (2026.01); H10W 72/856 (2026.01); H10W 74/15 (2026.01); H10W 90/701 (2026.01); H10W 90/724 (2026.01); H10W 90/734 (2026.01);
Abstract
The present disclosure relates to radio frequency (RF) chip packages and, more particularly, to improved thermal performance of RF chip packages and methods of manufacture. The structure includes: a board; a chip substrate; a pattern of solder bumps between the board and the chip substrate; and a thermal conductive material between the chip substrate and the board in depopulated regions of solder bumps of the chip substrate.
Malinowski, John. (2026). Package with thermal conductive material interspersed in depopulated regions of solder bumps (U.S. Patent No. 12677658). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12677658
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile