The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2026
Filed:
Aug. 28, 2023
Shanghai Huali Integrated Circuit Corporation, Shanghai, CN;
Shanghai Huali Integrated Circuit Corporation, Shanghai, CN;
Abstract
The present application provides a bottom layer metal interconnection line structure, at least including a test key and leads connected to the test key; the test key being composed of a plurality of metal lines connected end-to-end; the plurality of metal lines being arranged in the same plane in a winding manner, wherein at least one suspending via structure is provided at each winding point; and two leads are provided and respectively connected to ends of the metal lines located at a head end and a tail end in the test key. The present application increases a maximum root-mean-square current that the winding metal interconnection lines can withstand while improving a heat dissipation problem of the bottom layer metal interconnection lines.