The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2026
Filed:
Dec. 14, 2021
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Martin M. Chang, Beaverton, OR (US);
Tin Poay Chuah, Bayan Baru, MY;
Eng Huat Goh, Ayer Itam, MY;
Chu Aun Lim, Hillsboro, OR (US);
Min Suet Lim, Gelugor, MY;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/183 (2026.01); H05K 3/303 (2026.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); H05K 1/0298 (2013.01); H05K 1/113 (2013.01); H05K 1/141 (2013.01); H05K 3/303 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/10007 (2013.01); H05K 2201/10628 (2013.01); H05K 2201/10719 (2013.01); H05K 2201/10734 (2013.01); H05K 2203/041 (2013.01);
Abstract
An apparatus comprising a package comprising a first side to interface with at least one chip; and a second side to interface with a circuit board, the second side opposite to the first side, wherein the second side comprises a non-stepped portion comprising a first plurality of conductive contacts; and a stepped portion that protrudes from the non-stepped portion, the stepped portion comprising a second plurality of conductive contacts.