The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2026

Filed:

Jun. 01, 2023
Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Shota Tanii, Saitama, JP;

Akinori Morino, Chiba, JP;

Sumio Shimooka, Saitama, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/35 (2018.01);
U.S. Cl.
CPC ...
C09J 7/35 (2018.01); C09J 2301/1242 (2020.08); C09J 2301/312 (2020.08); C09J 2301/50 (2020.08);
Abstract

An adhesive sheet includes a first face and a second face opposite to each other. The first face includes a thermally expandable thermosetting adhesive layer A, and the second face includes a thermally expandable thermosetting adhesive layer B having a different composition from that of the thermally expandable thermosetting adhesive layer A. The thermally expandable thermosetting adhesive layer B is laminated on one face of the thermally expandable thermosetting adhesive layer A directly or through another layer. The first face has a higher shear adhesive strength than a shear adhesive strength of the second face. The thermally expandable thermosetting adhesive layer A and the thermally expandable thermosetting adhesive layer B each have a thickness direction expansion rate after heating at 150° C. for 60 minutes of 130% or more.


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