The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2026

Filed:

Sep. 15, 2022
Applicant:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Inventors:

Kyoung Yeon Lee, Incheon, KR;

Jae Beom Shim, Incheon, KR;

Byong Jin Kim, Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 1/48 (2006.01); H01Q 9/04 (2006.01); H10W 70/60 (2026.01); H10W 70/685 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H01Q 1/48 (2013.01); H01Q 9/0407 (2013.01); H10W 70/611 (2026.01); H10W 70/685 (2026.01); H10W 90/401 (2026.01); H10W 90/701 (2026.01); H10W 90/724 (2026.01);
Abstract

In one example, an electronic device comprises a lower substrate comprising a lower dielectric structure and a lower conductive structure, an electronic component coupled with a bottom side of the lower substrate and coupled with the lower conductive structure, an upper substrate over a top side of the lower substrate and comprising an upper dielectric structure and an upper conductive structure, an internal interconnect between the upper substrate and the lower substrate and coupled with the upper conductive structure and the lower conductive structure, and a first antenna component between the upper substrate and the lower substrate and coupled with the upper conductive structure. Other examples and related methods are also disclosed herein.


Find Patent Forward Citations

Lee, Kyoung. (2026). Semiconductor devices and methods of manufacturing semiconductor devices (U.S. Patent No. 12672584). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12672584

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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