The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2026

Filed:

Oct. 18, 2021
Applicant:

Altera Corporation, San Jose, CA (US);

Inventors:

Loke Yip Foo, Bayan Lepas, MY;

Teong Guan Yew, Batu Maung, MY;

Bok Eng Cheah, Gelugor, MY;

Assignee:

Altera Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 70/63 (2026.01); H10W 70/05 (2026.01); H10W 70/685 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/635 (2026.01); H10W 70/05 (2026.01); H10W 70/095 (2026.01); H10W 70/685 (2026.01); H10W 90/00 (2026.01);
Abstract

The present disclosure is directed generally to semiconductor packages, semiconductor package substrates, and methods for making them, which include packages substrates with embedded passive devices positioned between plated through hole vias configured for an improved power delivery network.


Find Patent Forward Citations

Foo, Loke. (2026). Package substrate with power delivery network (U.S. Patent No. 12672558). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12672558

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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