The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2026

Filed:

Jun. 16, 2023
Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Qiying Wong, Singapore, SG;

Handoko Linewih, Singapore, SG;

Phyllis Shi Ya Lim, Singapore, SG;

Chen Wai Samuel Chow, Singapore, SG;

Yudi Setiawan, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 20/40 (2026.01); H10D 1/47 (2025.01); H10W 20/42 (2026.01);
U.S. Cl.
CPC ...
H10W 20/498 (2026.01); H10D 1/472 (2025.01); H10D 1/474 (2025.01); H10W 20/42 (2026.01);
Abstract

An apparatus includes a resistor structure within a back end of line (BEOL) via level. The resistor structure includes a lower resistor film, a first insulating layer over the lower resistor film, an upper resistor film over the first insulating layer, and a second insulating layer over the upper resistor film. First and second upper metal lines are above the second insulating layer, a first end of the upper resistor film is coupled to the first upper metal line by a first upper via or contact, and a second end of the upper resistor film is coupled to the second upper metal line by a second upper via or contact. The apparatus may be a resistor or a thermistor of a semiconductor device.


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