The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
Sep. 22, 2022
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Tao Li, Slingerlands, NY (US);
Liqiao Qin, Albany, NY (US);
Devika Sarkar Grant, Amsterdam, NY (US);
Nikhil Jain, Apple Valley, MN (US);
Prabudhya Roy Chowdhury, Albany, NY (US);
Sagarika Mukesh, Albany, NY (US);
Kisik Choi, Watervliet, NY (US);
Ruilong Xie, Niskayuna, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 29/08 (2006.01); H01L 29/66 (2006.01); H10D 62/13 (2025.01); H10D 64/01 (2025.01); H10W 20/20 (2026.01);
U.S. Cl.
CPC ...
H10W 20/20 (2026.01); H10D 62/151 (2025.01); H10D 64/021 (2025.01);
Abstract
A semiconductor structure includes a source/drain region; a frontside source/drain contact disposed on the source/drain region, a via-to-backside power rail disposed on the frontside source/drain contact and on a portion of the source/drain region, and a backside power rail connected to the via-to-backside power rail.