The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
Aug. 29, 2023
Applicant:
Disco Corporation, Tokyo, JP;
Inventors:
Zhiwen Chen, Tokyo, JP;
Nobuyasu Kitahara, Tokyo, JP;
Assignee:
DISCO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/70 (2026.01); H10P 52/00 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01);
U.S. Cl.
CPC ...
H10P 72/7402 (2026.01); H10P 52/00 (2026.01); H10W 74/01 (2026.01); H10W 74/111 (2026.01); H10P 72/7416 (2026.01);
Abstract
A method of manufacturing laminated device chips includes affixing a support substrate to a face side of a first device wafer, processing the first device wafer from a reverse side thereof to thin down the first device wafer to a predetermined thickness, forming cut grooves in the first device wafer thereby to cut the first device wafer, affixing the first device wafer to a second device wafer, peeling off the support substrate from the first device wafer, and dividing the second device wafer into a plurality of laminated device chips.