The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2026

Filed:

Jul. 30, 2021
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Bo Hua Chen, Kaohsiung, TW;

Yan Ting Shen, Kaohsiung, TW;

Tsung Chi Wu, Kaohsiung, TW;

Tai-Hung Kuo, Kaohsiung, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/268 (2006.01); H10P 34/42 (2026.01); H10P 54/00 (2026.01);
U.S. Cl.
CPC ...
H10P 54/00 (2026.01); H10P 34/42 (2026.01);
Abstract

A method of manufacturing a semiconductor structure is provided. The method includes the following operations: providing a semiconductor substrate; performing a first cutting operation along a first set of cutting lines of the semiconductor substrate; and performing a second cutting operation along a second set of cutting lines of the semiconductor substrate later than performing the first cutting operation, wherein the second set of cutting lines are arranged interlacedly with the first set of cutting lines along a first direction.


Find Patent Forward Citations

Chen, Bo. (2026). Method of manufacturing semiconductor structure (U.S. Patent No. 12672498). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12672498

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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