The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
Jul. 07, 2022
Ambature, Inc., Scottsdale, AZ (US);
Mitchell Robson, Toronto, CA;
Michael S. Lebby, San Francisco, CA (US);
Davis H. Hartman, Scottsdale, AZ (US);
Ambature, Inc., Scottsdale, AZ (US);
Abstract
According to various implementations of the invention, high quality a-axis XBCO may be grown with low surface roughness. According to various implementations of the invention, low surface roughness may be obtained by: 1) adequate substrate preparation; 2) calibration of flux rates for constituent atoms; and/or 3) appropriate control of temperature during crystal growth. According to various implementions of the invention, a wafer comprises a smoothing layer of c-axis XBCO; a first conducting layer of a-axis XBCO formed on the smoothing layer; an insulating layer formed on the first conducting layer; and a second conducting layer of a-axis XBCO formed on the insulating layer, where, for a same surface roughness, a thickness of the smoothing layer and the first conducting layer combined is greater than a thickness of the first conducting layer without the smoothing layer. According to various implementations of the invention, a Josephson Junction is etched out of the XBCO/insulating layer/XBCO trilayer by: ion mill etching the top XBCO layer and some of the insulating layer to intentionally leave some of the insulating layer on the bottom XBCO layer; and/or ion mill etching at least the insulating layer at an off angle to reduce or minimize ion damage to the bottom XBCO layer otherwise introduced by the ion mill.