The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2026

Filed:

Sep. 14, 2023
Applicant:

Veeco Instruments Inc., Plainview, NY (US);

Inventors:

Rutvik J. Mehta, Plainview, NY (US);

Yuejing Wang, Plainview, NY (US);

Robert Caldwell, Plainview, NY (US);

Frank Cerio, Plainview, NY (US);

Assignee:

VEECO INSTRUMENTS INC., Plainview, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/14 (2006.01); C23C 14/22 (2006.01);
U.S. Cl.
CPC ...
C23C 14/221 (2013.01); C23C 14/14 (2013.01);
Abstract

Methods for forming a low resistivity ruthenium (Ru) thin film that include depositing ruthenium onto a substrate via ion beam deposition with assist ion beam in a process chamber having reactive and noble gas species therein. The substrate is at at least 250° C. A resulting thin ruthenium film has a thickness of no more than 30 nm, a resistivity less than 12 μ·cm and a crystalline structure comprising grains having a (0001) orientation. The resistivity will differ at different thickness; for example, less than 9 μΩ-cm for films of 50 nm and thicker, less than 9.5 μΩ-cm for films of 35 nm and thicker, less than 11 μΩ-cm for films of 20 nm and thicker, less than 15 μΩ-cm for films of 10 nm and thicker or less than 20 μΩ-cm for films of 2 nm and thicker. The grains have a mean grain size at least three times the film thickness.


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