The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
Jul. 15, 2021
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventor:
Ting-Jung Chen, Kaohsiung City, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0021 (2013.01); B81C 1/00158 (2013.01); B81B 2201/0257 (2013.01); B81B 2201/032 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0145 (2013.01); B81B 2203/0163 (2013.01); B81B 2203/019 (2013.01); B81B 2203/0315 (2013.01);
Abstract
Various embodiments of the present disclosure are directed towards a semiconductor device. The semiconductor device comprises a substrate. A cavity is disposed in the substrate. A microelectromechanical system (MEMS) layer is disposed over the substrate. The MEMS layer comprises a movable diaphragm disposed over the cavity. The movable diaphragm comprises a central region and a peripheral region. The movable diaphragm is flat in the central region of the movable diaphragm. The movable diaphragm is corrugated in the peripheral region of the movable diaphragm.