The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2026
Filed:
Feb. 12, 2023
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Chih-Hsuan Tai, Taipei City, TW;
Hsiang-Tai Lu, Hsinchu County, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A semiconductor package structure includes an interposer, an IPD package, a plurality of detecting bumps, and a plurality of daisy chains. The interposer includes at least a detecting pad and a plurality of bonding pads. The IPD package includes a plurality of metal bumps. The detecting bumps are disposed in the IPD package and separated from the metal bumps of the IPD package. The daisy chains are disposed in the IPD package and electrically connected to the detecting bumps.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile