The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2026
Filed:
Sep. 01, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
Disclosed is a semiconductor package comprising a substrate, a semiconductor chip on the substrate, a vertical structure on the substrate on one side of the semiconductor chip, a molding layer on the substrate and surrounding the semiconductor chip and the vertical structure, and a conductive pattern on the molding layer. The vertical structure includes a first part connected to a ground conductor of the substrate, and at least one second part on the first part and having a width less than a width of the first part. The conductive pattern includes at least one pad vertically spaced from the at least one second part, and an inductor pattern connected to the at least one pad. The at least one second part and the at least one pad form at least one capacitor.