The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2026
Filed:
Jul. 18, 2023
Applicant:
Disco Corporation, Tokyo, JP;
Inventor:
Masaru Nakamura, Tokyo, JP;
Assignee:
DISCO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/70 (2026.01); B24B 7/22 (2006.01); B24B 9/06 (2006.01); B24B 27/06 (2006.01); B24B 37/00 (2012.01); B24B 37/02 (2012.01); B24B 37/04 (2012.01); B24B 41/06 (2012.01); H10P 52/00 (2026.01); H10P 54/00 (2026.01);
U.S. Cl.
CPC ...
H10P 72/7402 (2026.01); B24B 7/228 (2013.01); B24B 9/065 (2013.01); B24B 27/06 (2013.01); B24B 37/00 (2013.01); B24B 37/02 (2013.01); B24B 37/04 (2013.01); B24B 41/06 (2013.01); H10P 52/00 (2026.01); H10P 54/00 (2026.01); H10P 72/7416 (2026.01);
Abstract
A chip treating method includes a first tape affixing step of affixing a first tape to a circular wafer, a ring frame unit forming step of removing a central part of the wafer to form a ring frame unit having an opening, and a chip disposing step of disposing chips on the first tape exposed in the opening.
Nakamura, Masaru. (2026). Chip treating method (U.S. Patent No. 12666923). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12666923
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile