The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2026

Filed:

Dec. 07, 2023
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Gideon Oyibo, Rensselaer, NY (US);

Tao Li, Slingerlands, NY (US);

Ruilong Xie, Niskayuna, NY (US);

Nicolas Jean Loubet, Guilderland, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/423 (2006.01); H01L 29/775 (2006.01); H01L 29/786 (2006.01); H10D 30/01 (2025.01); H10D 30/43 (2025.01); H10D 30/67 (2025.01); H10D 62/10 (2025.01); H10D 62/13 (2025.01); H10D 64/01 (2025.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01); H10D 84/83 (2025.01); H10W 10/00 (2026.01); H10W 10/17 (2026.01);
U.S. Cl.
CPC ...
H10D 30/6735 (2025.01); H10D 30/014 (2025.01); H10D 30/43 (2025.01); H10D 30/6757 (2025.01); H10D 62/115 (2025.01); H10D 62/121 (2025.01); H10D 62/151 (2025.01); H10D 64/017 (2025.01); H10D 84/0128 (2025.01); H10D 84/0149 (2025.01); H10D 84/0151 (2025.01); H10D 84/038 (2025.01); H10D 84/83 (2025.01); H10W 10/014 (2026.01); H10W 10/17 (2026.01);
Abstract

A microelectronic structure including a first nanosheet transistor that includes a first source/drain. A second nanosheet transistor that is adjacent to the first nanosheet transistor and the second nanosheet transistor includes a second source/drain. A first backside contact connected to a backside surface of the first source/drain. A second backside contact connected to a backside surface of the second source/drain. A first shallow trench fill layer located between the first backside contact and the second backside contact. A second shallow trench fill layer located adjacent to the first backside contact. The second shallow trench fill layer is located on the opposite side of the first backside contact than the first shallow trench isolation layer. A backside isolation pillar located on top of the first shallow trench isolation fill layer. A top surface of the backside isolation pillar is coplanar with a top surface of the first and second backside contact.


Find Patent Forward Citations

Oyibo, Gideon. (2026). Local backside contact isolation for merged backside contact patterning (U.S. Patent No. 12666652). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12666652

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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