The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2026

Filed:

Jul. 25, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventor:

Chung-Hui Chen, Hsinchu City, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 1/66 (2025.01); H10D 1/00 (2025.01); H10D 30/62 (2025.01); H10D 62/10 (2025.01); H10D 84/00 (2025.01); H10D 84/80 (2025.01); H10D 84/83 (2025.01); H10D 84/85 (2025.01); H10W 10/00 (2026.01); H10W 10/17 (2026.01);
U.S. Cl.
CPC ...
H10D 1/665 (2025.01); H10D 1/047 (2025.01); H10D 1/66 (2025.01); H10D 84/217 (2025.01); H10D 84/811 (2025.01); H10W 10/014 (2026.01); H10W 10/17 (2026.01); H10D 84/834 (2025.01);
Abstract

A semiconductor device including field-effect transistors (finFETs) and fin capacitors are formed on a silicon substrate. The fin capacitors include silicon fins, one or more electrical conductors between the silicon fins, and insulating material between the silicon fins and the one or more electrical conductors. The fin capacitors may also include insulating material between the one or more electrical conductors and underlying semiconductor material.


Find Patent Forward Citations

Chen, Chung-Hui. (2026). Decoupling finfet capacitors (U.S. Patent No. 12666631). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12666631

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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