The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2026

Filed:

Jun. 19, 2024
Applicant:

Sandisk Technologies, Inc., Milpitas, CA (US);

Inventors:

Li Chen, Sunnyvale, CA (US);

Beng Gian Ooi, Penang, MY;

Fu Xing Chan, Penang, MY;

Ye Bai, Shanghai, CN;

Kai Liu, Dublin, CA (US);

Chaolun Zheng, San Jose, CA (US);

Bo Yang, Dublin, CA (US);

Ning Ye, San Jose, CA (US);

Toshiki Hirano, San Jose, CA (US);

Assignee:

Sandisk Technologies, Inc., Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2025.01);
U.S. Cl.
CPC ...
H05K 5/0047 (2013.01);
Abstract

In the context of an electronic storage device such as a solid-state drive, a heat-mitigating enclosure includes one or more thermal conduction inhibitor interposed in the respective top or bottom enclosing structure and positioned between a relatively high-temperature electronic component such as an ASIC controller and/or PMIC of a corresponding PCB and a relatively low-temperature electronic component such as NAND memory. Such a thermal conduction inhibitor may include one or more through-hole through the enclosure structure and/or a recess extending into the enclosure structure, with or without a low thermal conductivity material embedded therein.


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