The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2026
Filed:
Jul. 31, 2024
Samsung Electronics Co., Ltd., Suwon-si, KR;
Yechung Chung, Suwon-si, KR;
Yoon-Seok Seo, Suwon-si, KR;
Jaehyun Lim, Suwon-si, KR;
Inho Choi, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A fingerprint sensor package includes: a substrate including an insulating layer and a wiring layer; a fingerprint sensor chip on the substrate; a molding material to mold the fingerprint sensor chip on the substrate and including a first region and a second region surrounding the first region; and a buffer member on the second region of the molding material; the wiring layer includes a wiring pattern extending from an inside to an outside of the molding material; a vertical level of an upper surface of the second region of the molding material is lower than a vertical level of an upper surface of the first region of the molding material.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile