The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2026
Filed:
Jun. 01, 2022
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Shih-Wei Peng, Hsinchu City, TW;
Wei-Cheng Tzeng, Taipei City, TW;
Wei-Cheng Lin, Taichung City, TW;
Jiann-Tyng Tzeng, Hsinchu City, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A method is provided, including following operations: obtaining information on gate pitch and a ratio between the gate pitch and a first metal line pitch; comparing a preset metal line end spacing with a second metal line pitch, of multiple metal traces, and a spacing between a metal line layer and a power rail layer; in response to the comparison, defining multiple first metal line patterns overlapping multiple first gate patterns and defining multiple second metal line patterns disposed between two adjacent gate patterns in multiple second gate patterns; placing the first metal line patterns in a first row in a floorplan of an integrated circuit layout design and the second metal line patterns in a second row, adjacent the first row; and manufacturing at least one element in an integrated circuit based on the integrated circuit layout design.