The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2026
Filed:
Sep. 01, 2023
Applicant:
Globalfoundries U.s. Inc., Malta, NY (US);
Inventors:
Jae Kyu Cho, Niskayuna, NY (US);
Norman Robson, Fishkill, NY (US);
Assignee:
GlobalFoundries U.S. Inc., Malta, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/13 (2006.01); G02B 6/12 (2006.01); G02B 6/122 (2006.01); H10W 74/01 (2026.01); H10W 90/00 (2026.01); H10W 70/09 (2026.01); H10W 70/60 (2026.01);
U.S. Cl.
CPC ...
G02B 6/13 (2013.01); G02B 6/12004 (2013.01); G02B 6/1228 (2013.01); H10W 74/019 (2026.01); H10W 90/00 (2026.01); H10W 70/09 (2026.01); H10W 70/60 (2026.01);
Abstract
Structures for a co-packaged photonics chip and electronic chip, and associated methods. The structure comprises a layer comprising a molding compound, an electronic chip and a photonics chip affixed in the layer, and a waveguiding structure including a waveguide core adjacent to the photonics chip. The photonics chip includes an optical coupler, the waveguide core includes a portion that overlaps with the optical coupler, and the waveguide core comprises a polymer.