The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2026
Filed:
Nov. 03, 2022
Showa Denko Materials Co., Ltd., Chiyodu-ku, JP;
Yuta Koseki, Chiyoda-ku, JP;
Daisuke Fujimoto, Chiyoda-ku, JP;
Kumpei Yamada, Chiyoda-ku, JP;
Naoya Suzuki, Chiyodu-ku, JP;
Hitoshi Onozeki, Chiyodu-ku, JP;
Hiroshi Takahashi, Chiyodu-ku, JP;
RESONAC CORPORATION, Tokyo, JP;
Abstract
The present invention provides a buffer sheet composition including a thermosetting compound, which buffer sheet composition is used for producing a buffer sheet to be interposed between a heating member and an electronic component, when the electronic component is heated by the heating member so as to mount the electronic component on a substrate, as well as a buffer sheet including a thermosetting composition layer obtained by forming the buffer sheet composition into the form of a sheet.