The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2026

Filed:

Oct. 25, 2022
Applicant:

Stmicroelectronics International N.v., Geneva, CH;

Inventor:

Roseanne Duca, Ghaxaq, MT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01); B81C 1/00 (2006.01); H10W 70/02 (2026.01); H10W 70/20 (2026.01); H10W 72/00 (2026.01); H10W 72/50 (2026.01); H10W 76/17 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
B81B 3/0072 (2013.01); B81C 1/00666 (2013.01); H10W 70/023 (2026.01); H10W 70/24 (2026.01); H10W 90/00 (2026.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01); B81B 2207/012 (2013.01); B81B 2207/015 (2013.01); B81B 2207/07 (2013.01); B81B 2207/096 (2013.01); B81C 2203/038 (2013.01); B81C 2203/0771 (2013.01); H10W 72/01 (2026.01); H10W 72/07552 (2026.01); H10W 72/521 (2026.01); H10W 72/823 (2026.01); H10W 76/17 (2026.01); H10W 90/752 (2026.01); H10W 90/753 (2026.01); H10W 90/754 (2026.01);
Abstract

A sensor package includes a packaging formed by a package bottom, first and second sidewalls extending upwardly from first and second opposite sides of the package bottom, and third and fourth sidewalls extending upwardly from third and fourth opposite sides of the package bottom, the sidewalls and package bottom defining a cavity. An integrated circuit is attached to the package bottom. A plate extends between two of the sidewalls within the cavity and is spaced apart from the package bottom. Sensors are attached to a top surface of the plate on opposite sides of an opening. Wire bondings electrically connect pads on a top face of the sensor to corresponding pads on a top face of the integrated circuit, for example by passing through the opening in the plate or passing past a side end of the plate. A lid extends across and between the sidewalls to close the cavity.


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