The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Oct. 20, 2023
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Fatma Arzum Simsek-Ege, Boise, ID (US);

Kunal R. Parekh, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2023.01); H10B 12/00 (2023.01); H10W 90/00 (2026.01); H10W 72/00 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10B 12/036 (2023.02); H10B 12/33 (2023.02); H10B 12/482 (2023.02); H10B 12/485 (2023.02); H10B 12/488 (2023.02); H10W 72/07331 (2026.01);
Abstract

A method of forming a microelectronic device comprises forming a microelectronic device structure assembly comprising memory cells, digit lines coupled to the memory cells, word lines coupled to the memory cells, and isolation material overlying the memory cells, the digit lines, and the word lines. An additional microelectronic device structure assembly comprising control logic devices and additional isolation material overlying the control logic devices is formed. The additional isolation material of the additional microelectronic device structure assembly is bonded to the isolation material of the microelectronic device structure assembly to attach the additional microelectronic device structure assembly to the microelectronic device structure assembly. The memory cells are electrically connected to at least some of the control logic devices after bonding the additional isolation material to the isolation material. Microelectronic devices, electronic systems, and additional methods are also described.


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