The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Feb. 23, 2022
Applicant:

Groq, Inc., Mountain View, CA (US);

Inventors:

Jonathan Alexander Ross, Palo Alto, CA (US);

Dinesh Maheshwari, Fremont, CA (US);

Assignee:

Groq, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 90/20 (2026.01); H10W 90/24 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 90/24 (2026.01); H10W 90/288 (2026.01); H10W 90/297 (2026.01);
Abstract

Embodiments are directed to an integrated circuit with one or more tile structures. The integrated circuit can include a first die and a second die connected to the first die forming a tile structure. The first die is shifted relative to the second die by a first shift amount along a first dimension and by a second shift amount along a second dimension orthogonal to the first dimension. The integrated circuit can further include an array of tile structures. Each tile structure in the array includes a first die, and a second die connected to the first die in a face-to-face configuration. The first die is shifted relative to the second die by a first shift amount along a first dimension and by a second shift amount along a second dimension orthogonal to the first dimension forming an offset alignment between the first die and the second die.


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