The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Aug. 29, 2023
Fuji Electric Co., Ltd., Kawasaki, JP;
Hayato Nakano, Yamanashi, JP;
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Abstract
[Problem] An object of the present invention is to provide a semiconductor module capable of preventing a wire wiring from being broken because of a crack having occurred in sealing resin. [Solution] A semiconductor moduleincludes semiconductor chipsto, sealing resinconfigured to seal the semiconductor chipsto, a caseincluding a casting area, first portionsand, and second portionsand, wire wiringstoandtosealed in the sealing resinwhile being located closer to the first portionand connected to the semiconductor chipsto, and recessed portions, andformed on the second portionsandbetween a virtual surface VSu and the first portion
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile