The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Jun. 30, 2022
Intel Corporation, Santa Clara, CA (US);
Kristof Darmawikarta, Chandler, AZ (US);
Srinivas Pietambaram, Chandler, AZ (US);
Benjamin Duong, Phoenix, AZ (US);
Haobo Chen, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Methods, apparatus, systems, and articles of manufacture are disclosed that adhere a dielectric to a nonconductive layer in circuit devices. An example apparatus includes an electrically conductive layer, a dielectric layer, and an electrically nonconductive layer separating the dielectric layer from the conductive layer, the nonconductive layer having a first surface facing the conductive layer and a second surface facing the dielectric layer, the first surface having a first roughness, the second surface having a second roughness greater than the first roughness.