The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Sep. 17, 2022
Applicant:

Amkor Technology Singapore Holding Pte. Ltd., Valley Point #12-03, SG;

Inventors:

Hyeong Il Jeon, Gyeonggi-do, KR;

Byong Jin Kim, Seoul, KR;

Gi Jeong Kim, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49565 (2013.01); H01L 21/4828 (2013.01); H01L 21/4842 (2013.01); H01L 23/49534 (2013.01); H01L 23/49558 (2013.01); H01L 23/49562 (2013.01); H01L 23/49582 (2013.01); H01L 23/49586 (2013.01); H01L 23/49548 (2013.01);
Abstract

In one example, a semiconductor device includes a substrate. The substrate includes a base including a top side and a cavity side opposite to the top side, leads extending from the cavity side, and an encapsulant interposed between the leads. An electronic component is located on the cavity side and spaced apart from the encapsulant. Other examples and related methods are also disclosed herein.


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