The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
May. 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chin-Shen Lin, Hsinchu, TW;
Ren-Zheng Liao, Hsinchu, TW;
Hao-Tien Kan, Hsinchu, TW;
Yung-Fong Lu, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A semiconductor devices includes a substrate, a power grid structure, and a through via penetrating the substrate. The power grid structure includes: first and second rails extending along a first direction, a conductive wire, a third rail, a conductive via, and a connecting member. The conductive wire is between the first and second rails, and extends along the first direction. The third rail is below the first rail, the second rail and the conductive wire, and extends along a second direction perpendicular to the first direction. The conductive via is between and electrically couples the conductive wire to the third rail. The connecting member is between and electrically couples the first rail to the conductive wire. The through via extends through the substrate and along a third direction perpendicular to the first direction and the second direction. The through via is disposed on and coupled to the conductive wire.