The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Dec. 09, 2022
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Satohiko Hoshino, Albany, NY (US);

Scott Lefevre, Albany, NY (US);

Yuji Mimura, Albany, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 14/60 (2026.01); H10P 10/00 (2026.01); H10P 72/00 (2026.01);
U.S. Cl.
CPC ...
H10P 14/6319 (2026.01); H10P 10/128 (2026.01); H10P 72/0402 (2026.01);
Abstract

A method for manufacturing semiconductor devices. The method includes placing a semiconductor wafer in a chamber. The method includes applying, in the chamber, a plasma that contains no fluorine. The plasma causes one or more components, in contact with the chamber, that each comprise a fluorinated coating to release its fluorine on a surface of the semiconductor wafer.


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