The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Feb. 13, 2023
Applicant:

Quanzhou Sanan Semiconductor Technology Co., Ltd, Fujian, CN;

Inventors:

Qiuxia Lin, Fujian, CN;

Dacheng Li, Fujian, CN;

Senpeng Huang, Fujian, CN;

Changchin Yu, Fujian, CN;

Chen-Ke Hsu, Fujian, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10H 20/855 (2025.01); H10H 20/01 (2025.01);
U.S. Cl.
CPC ...
H10H 20/855 (2025.01); H10H 20/01 (2025.01); H10H 20/0363 (2025.01);
Abstract

A light-emitting diode (LED) device includes a substrate, an LED chip, a light-transmissive element, and a bonding layer. The substrate has a first surface and a second surface opposite to the first surface in a thickness direction. The first surface has a functional region. The LED chip is disposed on the functional region of the first surface of the substrate. The light-transmissive element is disposed on the first surface of the substrate, and covers the LED chip. The bonding layer connects the substrate with the light-transmissive element, and is disposed on the substrate outside the functional region. The LED device has a surrounding surface. Cross sections of the surrounding surface in the thickness direction are straight lines that extend in the thickness direction.


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