The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Aug. 15, 2023
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Yu Nagahama, Tokyo, JP;

Yuya Abiko, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 64/01 (2025.01); H10D 30/01 (2025.01); H10D 30/66 (2025.01); H10D 64/00 (2025.01); H10D 64/27 (2025.01);
U.S. Cl.
CPC ...
H10D 64/01 (2025.01); H10D 30/0297 (2025.01); H10D 30/668 (2025.01); H10D 64/0135 (2026.01); H10D 64/112 (2025.01); H10D 64/117 (2025.01); H10D 64/516 (2025.01);
Abstract

A trench is formed in a semiconductor substrate. A first silicon oxide film is formed in an inside of the trench. A poly-crystalline silicon film is formed on the first silicon oxide film. A second silicon oxide film is formed from the poly-crystalline silicon film by performing a thermal oxidation treatment to the poly-crystalline silicon film. Thus, an insulating film including the first silicon oxide film and the second silicon oxide film is formed. A first conductive film is formed so as to embed the inside of the trench via the insulating film.


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Nagahama, Yu. (2026). Method of manufacturing semiconductor device (U.S. Patent No. 12660273). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12660273

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