The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Apr. 04, 2023
Applicant:

Changxin Memory Technologies, Inc., Hefei City, CN;

Inventors:

Runping Wu, Hefei, CN;

Daejoong Won, Hefei, CN;

Soonbyung Park, Hefei, CN;

Kanyu Cao, Hefei, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
H10B 12/34 (2023.02); H10B 12/053 (2023.02); H10B 12/482 (2023.02);
Abstract

Disclosed in the embodiments of the disclosure are a semiconductor structure and a manufacturing method therefor. The semiconductor structure includes: a substrate; a plurality of grooves, located in the substrate and extending in a first direction; a plurality of word line structures, located in the grooves; and a plurality of semiconductor layers, each at least partially located between a word line structure and an inner wall of a groove. The semiconductor layer includes oxide semiconductor material.


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