The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Jul. 08, 2022
Applicant:
Jx Metals Corporation, Tokyo, JP;
Inventor:
Yukito Yamamoto, Ibaraki, JP;
Assignee:
JX Advanced Metals Corporation, Toyko, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); B32B 15/09 (2006.01); B32B 15/20 (2006.01); B32B 27/36 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0083 (2013.01); B32B 15/09 (2013.01); B32B 15/20 (2013.01); B32B 27/36 (2013.01); B32B 2250/40 (2013.01); B32B 2250/42 (2013.01); B32B 2307/212 (2013.01); B32B 2307/7376 (2023.05); B32B 2457/00 (2013.01);
Abstract
A metal-resin composite electromagnetic shielding material, in which N (N is an integer of 1 or more) metal layers and M (M is an integer of 1 or more) resin layers are laminated with adhesive layers interposed therebetween, wherein among the adhesive layers, in the adhesive layer closest to an outer surface of the metal-resin composite electromagnetic shielding material, when observing the adhesive layer from the resin layer side, an air bubble ratio in the adhesive layer is 4.5% or less.