The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Oct. 20, 2022
Applicant:

The University of British Columbia, Vancouver, CA;

Inventors:

Matthew John Mitchell, Burnaby, CA;

Lukas Chrostowski, Vancouver, CA;

Becky Lin, Vancouver, CA;

Kashif Masud Awan, St. Louis, MO (US);

Shangxuan Yu, Vancouver, CA;

Donald Witt, Vancouver, CA;

Seyediman Taghavi, Vancouver, CA;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/02355 (2021.01); H01S 5/02345 (2021.01); H01S 5/0235 (2021.01); H10H 20/01 (2025.01); H10H 20/85 (2025.01);
U.S. Cl.
CPC ...
H01S 5/02355 (2021.01); H01S 5/0235 (2021.01); H10H 20/036 (2025.01); H10H 20/85 (2025.01); H10H 20/8502 (2025.01); H10H 20/8504 (2025.01); H10H 20/8506 (2025.01); H10H 20/8508 (2025.01); H01S 5/02345 (2021.01);
Abstract

Systems and methods for fabricating a semiconductor chip with an integrated laser diode (or other optical component). An example method may comprise fabricating a recess shaped to receive the optical component. The method may also comprise metallizing at least one surface of the recess. The method may also comprise coupling the optical component to the at least one metallized surface of the recess. The component may comprise a laser diode comprising a p-type semiconductor and an n-type semiconductor. The n-type semiconductor may be electrically coupled to the at least one metallized surface of the recess. The method may also comprise optically coupling an optical output of the laser diode (or other optical component) to an optical input of a photonic interface of the chip with a photonic wire bond and/or at least one polymer lens.


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