The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Jul. 31, 2023
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Kitae Park, Cupertino, CA (US);
Aaron Yip, Los Gatos, CA (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 5/06 (2006.01); G11C 16/08 (2006.01); H10B 80/00 (2026.01); H10W 20/41 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
G11C 5/063 (2013.01); G11C 16/08 (2013.01); H10B 80/00 (2023.02); H10W 20/435 (2026.01); H10W 90/00 (2026.01);
Abstract
A memory device includes a memory array die corresponding to a memory array, an access circuitry die corresponding to peripheral circuitry to support access operations with respect to the memory array, and a bonding layer disposed between the memory array die and the access circuitry die to form an interconnection between the memory array and the access circuitry. In some embodiments, the access circuitry die further integrates a local media controller corresponding to the memory array. In some embodiments, the local media controller is located external to the access circuitry die.