The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Jul. 26, 2023
Applicant:

Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);

Inventors:

Mitsuru Haga, Niigata, JP;

Cong Liu, Shrewsbury, MA (US);

James F. Cameron, Brookline, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/004 (2006.01); C08F 212/14 (2006.01); G03F 7/038 (2006.01); G03F 7/039 (2006.01); H10W 72/00 (2026.01);
U.S. Cl.
CPC ...
G03F 7/0045 (2013.01); C08F 212/24 (2020.02); G03F 7/038 (2013.01); G03F 7/039 (2013.01); H10W 72/01235 (2026.01); H10W 72/01255 (2026.01);
Abstract

Disclosed herein is a metallization method, comprising (a) providing a photoresist layer on a first surface of a substrate, wherein the photoresist layer is formed from a photoresist composition comprising: a polymer comprising acid-labile groups; a photoacid generator; an organic phosphonic acid; and a solvent; (b) pattern-wise exposing the photoresist layer to activating radiation; (c) developing the exposed photoresist layer with a basic developer to form a photoresist pattern; and (d) after forming the photoresist pattern, plating a metal on the first surface of the substrate using the photoresist pattern as a plating mask.


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