The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Feb. 10, 2023
Applicant:
Stmicroelectronics International N.v., Geneva, CH;
Inventors:
Enri Duqi, Milan, IT;
Giorgio Allegato, Monza, IT;
Assignee:
STMicroelectronics International N.V., Geneva, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01J 5/10 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
G01J 5/10 (2013.01); B81B 7/0038 (2013.01); B81B 7/007 (2013.01); B81C 1/00285 (2013.01); B81C 1/00301 (2013.01); B81B 2201/0278 (2013.01); B81B 2207/012 (2013.01); B81B 2207/07 (2013.01); B81B 2207/097 (2013.01); B81C 2203/0109 (2013.01); B81C 2203/0792 (2013.01); G01J 2005/106 (2013.01);
Abstract
Disclosed herein is a method of forming a thermal sensor, including patterning an active layer on a first face of a handle substrate to form a frame, a mass carrying at least one thermally isolated MOS (TMOS) transistor, and a spring structure connecting the mass to the frame while thermally isolating the mass from the frame. The frame is then bonded to pads on a first face of an integrated circuit substrate. The handle substrate is removed, and a top cap is bonded to the first face of the integrated circuit substrate to enclose at least the mass and spring within the sealed cavity.