The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Sep. 01, 2023
Applicant:
Tokyo Ohka Kogyo Co., Ltd., Kawasaki, JP;
Inventors:
Assignee:
TOKYO OHKA KOGYO CO., LTD., Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C11D 7/10 (2006.01); C11D 7/32 (2006.01); C11D 7/50 (2006.01); H05K 3/02 (2006.01); H05K 3/26 (2006.01);
U.S. Cl.
CPC ...
C11D 7/10 (2013.01); C11D 7/3209 (2013.01); C11D 7/3236 (2013.01); C11D 7/5013 (2013.01); H05K 3/02 (2013.01); H05K 3/26 (2013.01); C11D 2111/22 (2024.01); H05K 2203/0766 (2013.01);
Abstract
A metal residue removing liquid including a mixed solvent containing a first organic solvent and a second organic solvent, a salt of a base containing no metal ions and hydrofluoric acid, and water, in which the first organic solvent is diethylformamide, and the mixed solvent has a value of 0.6 or more, which is obtained by subtracting a hydrogen bond term of a Hansen solubility parameter from a polar term of the Hansen solubility parameter.
Ryzhii, Ivan. (2026). Metal residue removing liquid, metal residue removing method, and metal wiring manufacturing method (U.S. Patent No. 12655370). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12655370
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile