The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2026
Filed:
Dec. 21, 2023
Shinko Electric Industries Co., Ltd., Nagano, JP;
Kei Murayama, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Abstract
A semiconductor device includes a semiconductor element provided on a wiring board including a first signal pad, and a pair of first ground pads spaced apart from the first signal pad, arranged so as to sandwich the first signal pad and oppose each other in a plan view. The semiconductor element includes a second signal pad, and a pair of second ground pads spaced apart from the second signal pad and sandwiching the second signal pad and oppose each other. The second signal pad includes a first bump electrically connected to the first signal pad through a first bonding part. The pair of second ground pads includes second and third bumps. The third bump is closer to the second signal pad than the second bump, and at least the second bump is electrically connected to each of the pair of first ground pads through a second bonding part.