The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2026
Filed:
May. 18, 2022
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Assignee:
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/40 (2026.01); H10W 72/00 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/429 (2026.01); H10W 72/884 (2026.01); H10W 90/734 (2026.01); H10W 90/753 (2026.01); H10W 90/754 (2026.01);
Abstract
A power semiconductor apparatus includes an insulating substrate, a power semiconductor device, and an electrode terminal. The insulating substrate includes a conductive circuit pattern. The electrode terminal is ultrasonically bonded to the conductive circuit pattern. The electrode terminal includes a strip conductor and a conductive film. The conductive film is solid-phase diffusion bonded to the conductive circuit pattern. A first Vickers hardness of the conductive film is higher than a second Vickers hardness of the conductive circuit pattern.