The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2026
Filed:
Mar. 30, 2023
Applicant:
Fuji Electric Co., Ltd., Kawasaki, JP;
Inventors:
Rikihiro Maruyama, Matsumoto-city, JP;
Yoshinori Oda, Matsumoto-city, JP;
Takahito Harada, Matsumoto-city, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/40 (2026.01); H10W 72/00 (2026.01); H10W 72/50 (2026.01); H10W 74/10 (2026.01);
U.S. Cl.
CPC ...
H10W 70/427 (2026.01); H10W 70/465 (2026.01); H10W 70/468 (2026.01); H10W 72/075 (2026.01); H10W 72/50 (2026.01); H10W 72/865 (2026.01); H10W 72/884 (2026.01); H10W 74/114 (2026.01); H10W 74/127 (2026.01);
Abstract
A wire protecting part partially encloses a first lead frame and a second lead frame and has an enclosing surface from which the first and second lead frames protrude. The enclosing surface is parallel to semiconductor chips, and includes a water stop part protruding, from the enclosing surface, between the first and second lead frames.