The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2026
Filed:
Feb. 22, 2023
Renesas Electronics Corporation, Tokyo, JP;
Katsuhiko Kitagawa, Tokyo, JP;
Takehiko Maeda, Tokyo, JP;
Kuniharu Muto, Tokyo, JP;
Takeshi Miyakoshi, Tokyo, JP;
Renesas Electronics Corporation, Tokyo, JP;
Abstract
A semiconductor device includes: a die pad having an upper surface facing a semiconductor chip, a metal film formed on the upper surface, and a bonding material formed so as to cover the metal film. Here, the upper surface has: a first region overlapping the semiconductor chip, a second region not overlapping the semiconductor chip, a third region included in the first region and covered with the metal film, and a fourth region included in the first region and adjacent to the third region and also not covered with the metal film. Also, the semiconductor chip is mounted on the die pad such that a center of the semiconductor chip overlaps the third region. Further, an area of the third region is greater than or equal to 11% of an area of the first region, and less than or equal to 55% of the area of the first region.