The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2026

Filed:

Mar. 14, 2023
Applicant:

United Silicon Carbide, Inc., Princeton, NJ (US);

Inventor:

Ke Zhu, Princeton, NJ (US);

Assignee:

UNITED SILICON CARBIDE, INC., Scottsdale, AZ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 40/60 (2026.01); H02M 3/158 (2006.01); H05K 1/18 (2026.01); H05K 7/20 (2006.01); H10W 40/20 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 40/613 (2026.01); H02M 3/158 (2013.01); H05K 1/18 (2013.01); H05K 7/209 (2013.01); H10W 90/00 (2026.01); H05K 2201/09063 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10272 (2013.01); H05K 2201/10393 (2013.01); H05K 2201/10545 (2013.01); H10W 40/242 (2026.01); H10W 40/60 (2026.01); H10W 40/611 (2026.01);
Abstract

This disclosure relates to a cooling apparatus and a method for cooling semiconductor devices, wherein the cooling apparatus is disposed over a top surface and a bottom surface of a printed circuit board. The disclosed cooling apparatus comprises a printed circuit board, a first semiconductor device comprising a first thermal pad and mounted on a top surface of the printed circuit, a second semiconductor device comprising a second thermal pad and mounted on a bottom surface of the printed circuit, a first heat sink, a first thermal interface structure thermally coupled between the first thermal pad and the first heat sink, a second heat sink, and a second thermal interface structure thermally coupled between the second thermal pad and the second heat sink.


Find Patent Forward Citations

Zhu, Ke. (2026). Power block based on top-side cool surface-mount discrete devices with double-sided heat sinking (U.S. Patent No. 12653029). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12653029

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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