The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2026
Filed:
Oct. 26, 2023
Micron Technology, Inc., Boise, ID (US);
Shyam Surthi, Boise, ID (US);
Onorato Di Cola, Barete, IT;
Micron Technology, Inc., Boise, ID (US);
Abstract
A semiconductor device assembly including a first module having one or more memory arrays, each of the one or more memory arrays being connected to a plurality of landing pads of the first module; and a second module having complementary metal-oxide-semiconductor devices, the second module including a plurality of socket shallow trench isolation (STI) regions disposed in a substrate of the second module, a plurality of metal routing layers connected to corresponding CMOS devices, a plurality of a first type of via contacts each being connected to a corresponding one of the plurality of metal routing layers, and a plurality of a second type of via contacts each being connected to a corresponding one of the plurality of landing pads of the first module, wherein the plurality of the first type of via contacts and the plurality of the second via contacts pass through the plurality of socket STI regions.